Title: Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Abstract

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Inventors:

Stabach, Jennifer; McPherson, Brice; O'Neal, Chad B.

Issue Date:

Tue Sep 18 00:00:00 EDT 2018

Research Org.:

Cree Fayetteville, Inc., Fayetteville, AR (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1531819

Patent Number(s):

10076800

Application Number:

14/954,243

Assignee:

Cree Fayetteville, Inc. (Fayetteville, AR)

Patent Classifications (CPCs):

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

B23K1/0016 - {Brazing of electronic components}
B23K1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K26/361 - for deburring or mechanical trimming
B23K26/362 - Laser etching

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L23/13 - characterised by the shape
H01L23/3735 - {Laminates or multilayers, e.g. direct bond copper ceramic substrates}
H01L23/49894 - {Materials of the insulating layers or coatings}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K1/0263 - {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means
H05K2201/09363 - wherein only contours around conductors are removed for insulation
H05K2203/0315 - Oxidising metal
H05K2203/1173 - Differences in wettability, e.g. hydrophilic or hydrophobic areas
H05K3/027 - {the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}
H05K3/243 - {characterised by selective plating, e.g. for finish plating of pads
H05K3/341 - {Surface mounted components}

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DOE Contract Number:  

EE0006429; SC0008239

Resource Type:

Patent

Resource Relation:

Patent File Date: 2015-11-30

Country of Publication:

United States

Language:

English