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Title: Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks

Abstract

Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.

Inventors:
; ; ;
Issue Date:
Research Org.:
University of Chicago, IL (United States)
Sponsoring Org.:
USDOE; National Science Foundation (NSF)
OSTI Identifier:
1860142
Patent Number(s):
11194059
Application Number:
16/842,261
Assignee:
The University of Chicago (Chicago, IL)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01T - MEASUREMENT OF NUCLEAR OR X-RADIATION
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
DOE Contract Number:  
PHY1066014; SC0011262; SC0015267
Resource Type:
Patent
Resource Relation:
Patent File Date: 04/07/2020
Country of Publication:
United States
Language:
English

Citation Formats

Frisch, Henry J., Angelico, Evan, Elagin, Andrey Aleksandrovich, and Spieglan, Eric. Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks. United States: N. p., 2021. Web.
Frisch, Henry J., Angelico, Evan, Elagin, Andrey Aleksandrovich, & Spieglan, Eric. Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks. United States.
Frisch, Henry J., Angelico, Evan, Elagin, Andrey Aleksandrovich, and Spieglan, Eric. Tue . "Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks". United States. https://www.osti.gov/servlets/purl/1860142.
@article{osti_1860142,
title = {Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks},
author = {Frisch, Henry J. and Angelico, Evan and Elagin, Andrey Aleksandrovich and Spieglan, Eric},
abstractNote = {Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {12}
}

Works referenced in this record:

Metallic solder composite bonding
patent, September 1982


Waterproof Structure for Electronic Device
patent-application, March 2012


Use of Flat Panel Microchannel Photomultipliers in Sampling Calorimeters with Timing
patent-application, April 2016


Waterproof structure
patent, August 2016


Display Apparatus
patent-application, June 2015


Case Assembly Structure of Electronic Device
patent-application, November 2008


Low temperature hermetic sealing method having passivation layer
patent-application, June 2003


Waterproof Case for Electrical Apparatus
patent-application, June 2010


Electronic control apparatus for vehicle
patent, August 2017


Casing with channel discontinuity that resists capillary action
patent, April 2013


Batch Production of Microchannel Plate Photo-Multipliers
patent-application, September 2017


Housing seal interface
patent, April 1993


Soldering Method, Gyroscope and Soldered Part
patent-application, September 2012


Housing for electrical operating means
patent, April 2015