Printed circuit board for integrated LED driver

Song, Zhihua; Soer, Wouter; Bonne, Ron; Qiu, Yifeng

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Title: Printed circuit board for integrated LED driver

Abstract

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

Inventors:: Song, Zhihua; Soer, Wouter; Bonne, Ron; Qiu, Yifeng

Issue Date:: Tue Dec 25 00:00:00 EST 2018

Research Org.:: Lumileds LLC, San Jose, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1497862

Patent Number(s):: 10165640

Application Number:: 15/587,567

Assignee:: Lumileds LLC (San Jose, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L25/167 - {comprising optoelectronic devices, e.g. LED, photodiodes}
H01L25/50 - {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
H01R13/6591 - Specific features or arrangements of connection of shield to conductive members

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
H05B45/10 - Controlling the intensity of the light
H05B45/3725 - Switched mode power supply [SMPS]
H05B47/20 - Responsive to malfunctions or to light source life

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0203 - {Cooling of mounted components
H05K1/0215 - {Grounding of printed circuits by connection to external grounding means}
H05K1/0224 - {Patterned shielding planes, ground planes or power planes
H05K1/024 - {Dielectric details, e.g. changing the dielectric material around a transmission line}
H05K1/0243 - {Printed circuits associated with mounted high frequency components}
H05K1/0251 - {related to vias or transitions between vias and transmission lines}
H05K1/0262 - {Arrangements for regulating voltages or for using plural voltages}
H05K1/053 - {the metal substrate being covered by an inorganic insulating layer}
H05K1/056 - {the metal substrate being covered by an organic insulating layer}
H05K1/111 - {Pads for surface mounting, e.g. lay-out}
H05K1/115 - {Via connections
H05K1/181 - {associated with surface mounted components}
H05K13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K2201/066 - Heatsink mounted on the surface of the PCB
H05K2201/0723 - provided by an inner layer of PCB
H05K2201/093 - Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
H05K2201/09327 - Special sequence of power, ground and signal layers in multilayer PCB
H05K2201/09563 - Metal filled via
H05K2201/10106 - Light emitting diode [LED]
H05K2201/10166 - Transistor
H05K2201/10522 - Adjacent components
H05K3/0061 - {onto a metallic substrate, e.g. a heat sink
H05K3/107 - {by filling grooves in the support with conductive material
H05K3/146 - {By vapour deposition}
H05K3/16 - by cathodic sputtering
H05K3/181 - {by electroless plating
H05K3/303 - {Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
H05K3/4076 - {by thin-film techniques}
H05K3/44 - Manufacture insulated metal core circuits {or other insulated electrically conductive core circuits
H05K3/4608 - {comprising an electrically conductive core}
H05K3/4644 - {by building the multilayer layer by layer, i.e. build-up multilayer circuits
H05K3/465 - {by applying an insulating layer having channels for the next circuit layer}
H05K3/4661 - {Adding a circuit layer by direct wet plating, e.g. electroless plating
H05K3/467 - {Adding a circuit layer by thin film methods
H05K3/4679 - {Aligning added circuit layers or via connections relative to previous circuit layers}
H05K3/4688 - {Composite multilayer circuits, i.e. comprising insulating layers having different properties
H05K9/0084 - {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition}
H05K9/0088 - {comprising a plurality of shielding layers

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DOE Contract Number:: EE0006703

Resource Type:: Patent

Resource Relation:: Patent File Date: 2012 Dec 19

Country of Publication:: United States

Language:: English

Citation Formats


                    Song, Zhihua, Soer, Wouter, Bonne, Ron, and Qiu, Yifeng. Printed circuit board for integrated LED driver.  United States: N. p., 2018. 
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                    Song, Zhihua, Soer, Wouter, Bonne, Ron, & Qiu, Yifeng. Printed circuit board for integrated LED driver.  United States.

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                    Song, Zhihua, Soer, Wouter, Bonne, Ron, and Qiu, Yifeng. Tue .  
        "Printed circuit board for integrated LED driver".  United States.  https://www.osti.gov/servlets/purl/1497862.

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@article{osti_1497862,

  title        = {Printed circuit board for integrated LED driver},

  author       = {Song, Zhihua and Soer, Wouter and Bonne, Ron and Qiu, Yifeng},

  abstractNote = {A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Dec 25 00:00:00 EST 2018},

  month        = {Tue Dec 25 00:00:00 EST 2018}

}

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