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Title: Printed circuit board for integrated LED driver

Abstract

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lumileds LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1771701
Patent Number(s):
10856376
Application Number:
16/184,565
Assignee:
Lumileds LLC (San Jose, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
DOE Contract Number:  
EE0006703
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/08/2018
Country of Publication:
United States
Language:
English

Citation Formats

Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Printed circuit board for integrated LED driver. United States: N. p., 2020. Web.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, & Qiu, Yifeng. Printed circuit board for integrated LED driver. United States.
Song, Zhihua, Soer, Wouter Anthon, Bonne, Ron, and Qiu, Yifeng. Tue . "Printed circuit board for integrated LED driver". United States. https://www.osti.gov/servlets/purl/1771701.
@article{osti_1771701,
title = {Printed circuit board for integrated LED driver},
author = {Song, Zhihua and Soer, Wouter Anthon and Bonne, Ron and Qiu, Yifeng},
abstractNote = {A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {12}
}

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