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Title: Solder assembly of pins to the peripheral end face of a printed circuit board

Abstract

A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Inventors:
; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568469
Patent Number(s):
10321564
Application Number:
15/808,786
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
B621073
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/09/2017
Country of Publication:
United States
Language:
English

Citation Formats

Takken, Todd E., Zhang, Xin, Yao, Yuan, and Ferencz, Andrew. Solder assembly of pins to the peripheral end face of a printed circuit board. United States: N. p., 2019. Web.
Takken, Todd E., Zhang, Xin, Yao, Yuan, & Ferencz, Andrew. Solder assembly of pins to the peripheral end face of a printed circuit board. United States.
Takken, Todd E., Zhang, Xin, Yao, Yuan, and Ferencz, Andrew. Tue . "Solder assembly of pins to the peripheral end face of a printed circuit board". United States. https://www.osti.gov/servlets/purl/1568469.
@article{osti_1568469,
title = {Solder assembly of pins to the peripheral end face of a printed circuit board},
author = {Takken, Todd E. and Zhang, Xin and Yao, Yuan and Ferencz, Andrew},
abstractNote = {A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {6}
}

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