Conformally encapsulated multi-electrode arrays with seamless insulation
Abstract
Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1333300
- Patent Number(s):
- 9498617
- Application Number:
- 13/792,708
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- Patent Classifications (CPCs):
-
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61B - DIAGNOSIS
A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61K - PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Mar 11
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, and Felix, Sarah. Conformally encapsulated multi-electrode arrays with seamless insulation. United States: N. p., 2016.
Web.
Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, & Felix, Sarah. Conformally encapsulated multi-electrode arrays with seamless insulation. United States.
Tabada, Phillipe J., Shah, Kedar G., Tolosa, Vanessa, Pannu, Satinderall S., Tooker, Angela, Delima, Terri, Sheth, Heeral, and Felix, Sarah. Tue .
"Conformally encapsulated multi-electrode arrays with seamless insulation". United States. https://www.osti.gov/servlets/purl/1333300.
@article{osti_1333300,
title = {Conformally encapsulated multi-electrode arrays with seamless insulation},
author = {Tabada, Phillipe J. and Shah, Kedar G. and Tolosa, Vanessa and Pannu, Satinderall S. and Tooker, Angela and Delima, Terri and Sheth, Heeral and Felix, Sarah},
abstractNote = {Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 22 00:00:00 EST 2016},
month = {Tue Nov 22 00:00:00 EST 2016}
}
Works referenced in this record:
Thin film fabrication technique for implantable electrodes
patent, February 1998
- Parker, John Louis; Treaba, Claudiu
- US Patent Document 5,720,099
Method of manufacturing a flexible circuit electrode array
patent, March 2011
- Greenberg, Robert J.; Talbot, Neil Hamilton; Neysmith, Jordan Matthew
- US Patent Document 7,914,842
Method of fabricating conductive electrodes on the front and backside of a thin film structure
patent, May 2012
- Tabada, Phillipe J.; Pannu, Satinderpall S.
- US Patent Document 8,183,111