Title: Cooling system for electronic components

Abstract

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Inventors:

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

Issue Date:

Tue Dec 15 00:00:00 EST 2015

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1229731

Patent Number(s):

9213378

Application Number:

13/781,837

Assignee:

International Business Machines Corporation

Patent Classifications (CPCs):

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

G06F1/206 - {comprising thermal management}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/4093 - {Snap-on arrangements, e.g. clips}
H01L23/473 - by flowing liquids {
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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DOE Contract Number:  

B554331

Resource Type:

Patent

Resource Relation:

Patent File Date: 2013 Mar 01

Country of Publication:

United States

Language:

English

Subject:

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION