Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
Abstract
Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corporation, Armonk, NY (United States) (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1430506
- Patent Number(s):
- 9930806
- Application Number:
- 14/086,114
- Assignee:
- International Business Machines Corporation, Armonk, NY
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Nov 21
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E. Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component. United States: N. p., 2018.
Web.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., & Steinke, Mark E. Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component. United States.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E. Tue .
"Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component". United States. https://www.osti.gov/servlets/purl/1430506.
@article{osti_1430506,
title = {Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component},
author = {Chainer, Timothy J. and Graybill, David P. and Iyengar, Madhusudan K. and Kamath, Vinod and Kochuparambil, Bejoy J. and Schmidt, Roger R. and Steinke, Mark E.},
abstractNote = {Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 27 00:00:00 EDT 2018},
month = {Tue Mar 27 00:00:00 EDT 2018}
}