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Title: Cooling system for electronic components

Abstract

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1253346
Patent Number(s):
9,342,121
Application Number:
12/417,921
Assignee:
International Business Machines Corporatoin (Armonk, NY)
DOE Contract Number:  
B554331
Resource Type:
Patent
Resource Relation:
Patent File Date: 2009 Apr 03
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats

Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, and Tian, Shurong. Cooling system for electronic components. United States: N. p., 2016. Web.
Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, & Tian, Shurong. Cooling system for electronic components. United States.
Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, and Tian, Shurong. Tue . "Cooling system for electronic components". United States. https://www.osti.gov/servlets/purl/1253346.
@article{osti_1253346,
title = {Cooling system for electronic components},
author = {Anderl, William James and Colgan, Evan George and Gerken, James Dorance and Marroquin, Christopher Michael and Tian, Shurong},
abstractNote = {Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {5}
}

Patent:

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