Cooling system for electronic components

Title: Cooling system for electronic components

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Abstract

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Inventors:: Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

Issue Date:: 2016-05-17

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1253346

Patent Number(s):: 9342121

Application Number:: 12/417,921

Assignee:: International Business Machines Corporatoin (Armonk, NY)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/473 - by flowing liquids {
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
G06F1/206 - {comprising thermal management}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L23/4093 - {Snap-on arrangements, e.g. clips}

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DOE Contract Number:: B554331

Resource Type:: Patent

Resource Relation:: Patent File Date: 2009 Apr 03

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION

Citation Formats


                    Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, and Tian, Shurong. Cooling system for electronic components.  United States: N. p., 2016. 
        Web.

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                    Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, & Tian, Shurong. Cooling system for electronic components.  United States.

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                    Anderl, William James, Colgan, Evan George, Gerken, James Dorance, Marroquin, Christopher Michael, and Tian, Shurong. Tue .  
        "Cooling system for electronic components".  United States.  https://www.osti.gov/servlets/purl/1253346.

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@article{osti_1253346,

  title        = {Cooling system for electronic components},

  author       = {Anderl, William James and Colgan, Evan George and Gerken, James Dorance and Marroquin, Christopher Michael and Tian, Shurong},

  abstractNote = {Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2016},

  month        = {5}

}

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