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Title: Assembly of opto-electronic module with improved heat sink

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
Inventors:
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [8];  [7]
  1. (Vestal, NY)
  2. (Richelieu, CA)
  3. (Rochester, MN)
  4. (Binghampton, NY)
  5. (Stukely-sud, CA)
  6. (Yorktown Heights, NY)
  7. (Granby, CA)
  8. (Lisle, NY)
Issue Date:
OSTI Identifier:
879857
Assignee:
International Business Machines Corporation (Armonk, NY) OSTI
Patent Number(s):
US 6,822,875
Application Number:
10/281036
Contract Number:
W-7405-ENG-48
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Country of Publication:
United States
Language:
English