Low temperature reactive bonding
Abstract
The joining technique requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process.
- Inventors:
-
- Livermore, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 869705
- Patent Number(s):
- 5381944
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- temperature; reactive; bonding; joining; technique; requires; external; heat; source; generates; involves; reaction; multilayered; films; deposited; faying; surfaces; create; stable; compound; functions; intermediate; braze; material; strength; bond; temperatures; reached; multilayer; film; generated; essentially; process; external heat; films deposited; multilayer film; braze material; heat source; stable compound; temperature joining; faying surfaces; /228/428/
Citation Formats
Makowiecki, Daniel M, and Bionta, Richard M. Low temperature reactive bonding. United States: N. p., 1995.
Web.
Makowiecki, Daniel M, & Bionta, Richard M. Low temperature reactive bonding. United States.
Makowiecki, Daniel M, and Bionta, Richard M. Sun .
"Low temperature reactive bonding". United States. https://www.osti.gov/servlets/purl/869705.
@article{osti_869705,
title = {Low temperature reactive bonding},
author = {Makowiecki, Daniel M and Bionta, Richard M},
abstractNote = {The joining technique requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {1}
}
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