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Title: Low temperature reactive bonding

The joining technique requires no external heat source and generates very little heat during joining. It involves the reaction of thin multilayered films deposited on faying surfaces to create a stable compound that functions as an intermediate or braze material in order to create a high strength bond. While high temperatures are reached in the reaction of the multilayer film, very little heat is generated because the films are very thin. It is essentially a room temperature joining process.
Inventors:
 [1];  [1]
  1. (Livermore, CA)
Issue Date:
OSTI Identifier:
869705
Assignee:
Regents of University of California (Oakland, CA) LLNL
Patent Number(s):
US 5381944
Contract Number:
W-7405-ENG-48
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Country of Publication:
United States
Language:
English
Subject:
temperature; reactive; bonding; joining; technique; requires; external; heat; source; generates; involves; reaction; multilayered; films; deposited; faying; surfaces; create; stable; compound; functions; intermediate; braze; material; strength; bond; temperatures; reached; multilayer; film; generated; essentially; process; external heat; films deposited; multilayer film; braze material; heat source; stable compound; temperature joining; faying surfaces; /228/428/

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