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Title: Low Temperature Material Bonding Technique

Patent ·
OSTI ID:879537

A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
DOE Contract Number:
AC05-84OR21400
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Number(s):
US 6,129,854
Application Number:
09/098744
OSTI ID:
879537
Country of Publication:
United States
Language:
English