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Title: Low Temperature Material Bonding Technique

Abstract

A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.

Inventors:
 [1];  [2]
  1. Knoxville, TN
  2. Oak Ridge, TN
Issue Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
OSTI Identifier:
879537
Patent Number(s):
6129854
Application Number:
09/098744
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Ramsey, J Michael, and Foote, Robert S. Low Temperature Material Bonding Technique. United States: N. p., 2000. Web.
Ramsey, J Michael, & Foote, Robert S. Low Temperature Material Bonding Technique. United States.
Ramsey, J Michael, and Foote, Robert S. Tue . "Low Temperature Material Bonding Technique". United States. https://www.osti.gov/servlets/purl/879537.
@article{osti_879537,
title = {Low Temperature Material Bonding Technique},
author = {Ramsey, J Michael and Foote, Robert S},
abstractNote = {A method of performing a lower temperature bonding technique to bond together two mating pieces of glass includes applying a sodium silicate aqueous solution between the two pieces.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {10}
}