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Title: Low-temperature bonding with spaced nanorods and eutectic alloys

Abstract

Bonded surfaces are formed by adhering first nanorods and second nanorods to respective first and second surfaces. The first shell is formed on the first nanorods and the second shell is formed on the second nanorods, wherein at least one of the first nanorods and second nanorods, and the first shell and the second shell are formed of distinct metals. The surfaces are then exposed to at least one condition that causes the distinct metals to form an alloy, such as eutectic alloy having a melting point below the temperature at which the alloy is formed, thereby bonding the surfaces upon which solidification of the alloy.

Inventors:
; ;
Issue Date:
Research Org.:
Northeastern Univ., Boston, MA (United States); Univ. of North Florida, Jacksonville, FL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1650879
Patent Number(s):
10646964
Application Number:
15/746,536
Assignee:
Northeastern University (Boston, MA); University of North Florida Board of Trustees (Jacksonville, FL)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
SC0000894; SC0014035
Resource Type:
Patent
Resource Relation:
Patent File Date: 07/19/2016
Country of Publication:
United States
Language:
English

Citation Formats

Stagon, Stephen Peter, Huang, Hanchen, and Elliott, Paul Robert. Low-temperature bonding with spaced nanorods and eutectic alloys. United States: N. p., 2020. Web.
Stagon, Stephen Peter, Huang, Hanchen, & Elliott, Paul Robert. Low-temperature bonding with spaced nanorods and eutectic alloys. United States.
Stagon, Stephen Peter, Huang, Hanchen, and Elliott, Paul Robert. Tue . "Low-temperature bonding with spaced nanorods and eutectic alloys". United States. https://www.osti.gov/servlets/purl/1650879.
@article{osti_1650879,
title = {Low-temperature bonding with spaced nanorods and eutectic alloys},
author = {Stagon, Stephen Peter and Huang, Hanchen and Elliott, Paul Robert},
abstractNote = {Bonded surfaces are formed by adhering first nanorods and second nanorods to respective first and second surfaces. The first shell is formed on the first nanorods and the second shell is formed on the second nanorods, wherein at least one of the first nanorods and second nanorods, and the first shell and the second shell are formed of distinct metals. The surfaces are then exposed to at least one condition that causes the distinct metals to form an alloy, such as eutectic alloy having a melting point below the temperature at which the alloy is formed, thereby bonding the surfaces upon which solidification of the alloy.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {5}
}

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Works referenced in this record:

Die bonding process
patent, September 1988