Titanium nitride thin films for minimizing multipactoring
Abstract
Applying a thin film coating to the surface of a workpiece, in particular, applying a coating of titanium nitride to a klystron window by means of a crossed-field diode sputtering array. The array is comprised of a cohesive group of numerous small hollow electrically conducting cylinders and is mounted so that the open ends of the cylinders on one side of the group are adjacent a titanium cathode plate. The workpiece is mounted so as to face the open ends of the other side of the group. A magnetic field is applied to the array so as to be coaxial with the cylinders and a potential is applied across the cylinders and the cathode plate, the cylinders as an anode being positive with respect to the cathode plate. The cylinders, the cathode plate and the workpiece are situated in an atmosphere of nitrogen which becomes ionized such as by field emission because of the electric field between the cylinders and cathode plate, thereby establishing an anode-cathode discharge that results in sputtering of the titanium plate. The sputtered titanium coats the workpiece and chemically combines with the nitrogen to form a titanium nitride coating on the workpiece. Gas pressure, gas mixtures,more »
- Inventors:
-
- Mountain View, CA
- Issue Date:
- Research Org.:
- SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)
- OSTI Identifier:
- 863333
- Patent Number(s):
- 4151325
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- DOE Contract Number:
- AC03-76SF00515
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- titanium; nitride; films; minimizing; multipactoring; applying; film; coating; surface; workpiece; particular; klystron; window; means; crossed-field; diode; sputtering; array; comprised; cohesive; numerous; hollow; electrically; conducting; cylinders; mounted; adjacent; cathode; plate; magnetic; field; applied; coaxial; potential; anode; positive; respect; situated; atmosphere; nitrogen; ionized; emission; electric; establishing; anode-cathode; discharge; results; sputtered; coats; chemically; combines; form; gas; pressure; mixtures; material; composition; voltages; spacing; aspect; ratio; length; inner; diameter; controlled; provide; consistent; optimum; coatings; various; compositions; thicknesses; facet; disclosure; microwave; components; reduce; operating; conditions; voltages applied; material composition; inner diameter; cathode plate; gas mixtures; operating conditions; aspect ratio; titanium nitride; electric field; magnetic field; field emission; gas pressure; electrically conducting; gas mixture; cathode material; film coating; operating condition; provide consistent; reduce multipactoring; titanium coats; titanium cathode; titanium plate; sputtered titanium; sputtering array; workpiece spacing; anode cylinders; anode-cathode discharge; microwave components; chemically combines; nitride coating; crossed-field diode; diode sputtering; various compositions; hollow electrically; cathode discharge; film coatings; conducting cylinders; consistent optimum; klystron window; wave components; /428/204/313/315/427/505/
Citation Formats
Welch, Kimo M. Titanium nitride thin films for minimizing multipactoring. United States: N. p., 1979.
Web.
Welch, Kimo M. Titanium nitride thin films for minimizing multipactoring. United States.
Welch, Kimo M. Mon .
"Titanium nitride thin films for minimizing multipactoring". United States. https://www.osti.gov/servlets/purl/863333.
@article{osti_863333,
title = {Titanium nitride thin films for minimizing multipactoring},
author = {Welch, Kimo M},
abstractNote = {Applying a thin film coating to the surface of a workpiece, in particular, applying a coating of titanium nitride to a klystron window by means of a crossed-field diode sputtering array. The array is comprised of a cohesive group of numerous small hollow electrically conducting cylinders and is mounted so that the open ends of the cylinders on one side of the group are adjacent a titanium cathode plate. The workpiece is mounted so as to face the open ends of the other side of the group. A magnetic field is applied to the array so as to be coaxial with the cylinders and a potential is applied across the cylinders and the cathode plate, the cylinders as an anode being positive with respect to the cathode plate. The cylinders, the cathode plate and the workpiece are situated in an atmosphere of nitrogen which becomes ionized such as by field emission because of the electric field between the cylinders and cathode plate, thereby establishing an anode-cathode discharge that results in sputtering of the titanium plate. The sputtered titanium coats the workpiece and chemically combines with the nitrogen to form a titanium nitride coating on the workpiece. Gas pressure, gas mixtures, cathode material composition, voltages applied to the cathode and anode, the magnetic field, cathode, anode and workpiece spacing, and the aspect ratio (ratio of length to inner diameter) of the anode cylinders, all may be controlled to provide consistent optimum thin film coatings of various compositions and thicknesses. Another facet of the disclosure is the coating of microwave components per se with titanium nitride to reduce multipactoring under operating conditions of the components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1979},
month = {Mon Jan 01 00:00:00 EST 1979}
}