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Title: Circuit board and method of forming same

Abstract

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

Inventors:
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1735309
Patent Number(s):
10785878
Application Number:
16/408,772
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 05/10/2019
Country of Publication:
United States
Language:
English

Citation Formats

Girardi, Michael. Circuit board and method of forming same. United States: N. p., 2020. Web.
Girardi, Michael. Circuit board and method of forming same. United States.
Girardi, Michael. Tue . "Circuit board and method of forming same". United States. https://www.osti.gov/servlets/purl/1735309.
@article{osti_1735309,
title = {Circuit board and method of forming same},
author = {Girardi, Michael},
abstractNote = {A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {9}
}

Patent:

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Works referenced in this record:

Apparatus and method for longitudinal diode bar pumping of solid state lasers
patent, August 1992


Planarized ceramic substrates
patent, August 1988


Method of forming uniform features using photoresist
patent, July 2009