skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

Abstract

This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region ofmore » the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.« less

Inventors:
 [1];  [1];  [1];  [1];  [2];  [1];  [3];  [1];  [4]
  1. Albuquerque, NM
  2. (Albuquerque, NM)
  3. Sandia Park, NM
  4. Lafayette, CO
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
879683
Patent Number(s):
6867377
Application Number:
09/749281
Assignee:
EMCORE Corporation (Somerset, NJ)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Anderson, Gene R, Armendariz, Marcelino G, Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, and Reysen, Bill H. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device. United States: N. p., 2005. Web.
Anderson, Gene R, Armendariz, Marcelino G, Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, & Reysen, Bill H. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device. United States.
Anderson, Gene R, Armendariz, Marcelino G, Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Peterson, David W, Peterson, Gary D, and Reysen, Bill H. Tue . "Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device". United States. https://www.osti.gov/servlets/purl/879683.
@article{osti_879683,
title = {Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device},
author = {Anderson, Gene R and Armendariz, Marcelino G and Bryan, Robert P and Carson, Richard F and Duckett, III, Edwin B. and McCormick, Frederick B and Peterson, David W and Peterson, Gary D and Reysen, Bill H},
abstractNote = {This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {3}
}

Patent:

Save / Share:

Works referenced in this record:

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
conference, January 1996

  • Wong, Y. M.; Muehlner, D. J.; Faudskar, C. C.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517403

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
conference, January 1996

  • De Pestel, G.; Picard, A.; Vandewege, J.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517402

The PONI optoelectronic platform
conference, January 1999

  • Giboney, K.; Rosenberg, P.; Yuen, A.
  • 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009)
  • https://doi.org/10.1109/LEOS.1999.813458

A complete sub-system of parallel optical interconnects for telecom applications
conference, January 1996

  • Niburg, M.; Eriksen, P.; Gustafsson, K.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517401

The PONI-1 parallel-optical link
conference, January 1999


Parallel optical interconnects
conference, January 2000

  • Buckman, L. A.; Giboney, K. S.; Straznicky, J.
  • Conference on Lasers and Electro-Optics (CLEO 2000). Technical Digest. Postconference Edition. TOPS Vol.39 (IEEE Cat. No.00CH37088)
  • https://doi.org/10.1109/CLEO.2000.907355

The P-VixeLink/sup TM/ multichannel optical interconnect
conference, January 1996

  • Swirhun, S.; Dudek, M.; Neumann, R.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517408

Gigabyte/s data communications with the POLO parallel optical link
conference, January 1996

  • Hahn, K. H.; Giboney, K. S.; Wilson, R. E.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517406

1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics
conference, January 1999


Use of VCSEL arrays for parallel optical interconnects
conference, April 1996


Electro-optical circuit boards with four-channel butt-coupled optical transmitter and receiver modules
conference, December 2001


Low-cost molded packaging for optical data links
journal, May 1995

  • Robinson, S. D.; Acarlar, M. S.; Chen, Y. C.
  • IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, Vol. 18, Issue 2
  • https://doi.org/10.1109/96.386247

Low-power modular parallel photonic data links
conference, January 1996

  • Carson, R. F.; Lovejoy, M. L.; Lear, K. L.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.551417

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
conference, January 1996

  • Nagahori, T.; Miyoshi, K.; Hatakeyama, I.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517400

High alignment tolerance coupling scheme for multichannel laser diode/singlemode fibre modules using a tapered waveguide array
journal, September 1994