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Title: Printed circuit board impedance matching step for microwave (millimeter wave) devices

Abstract

An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

Inventors:
; ;
Issue Date:
Research Org.:
LLNL (Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States))
Sponsoring Org.:
USDOE
OSTI Identifier:
1107573
Patent Number(s):
8,547,187
Application Number:
12/895,347
Assignee:
Lawrence Livermore National Security, LLC. (Livermore, CA); Kyocera America, Inc. (San Diego, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Pao, Hsueh-Yuan, Aguirre, Jerardo, and Sargis, Paul. Printed circuit board impedance matching step for microwave (millimeter wave) devices. United States: N. p., 2013. Web.
Pao, Hsueh-Yuan, Aguirre, Jerardo, & Sargis, Paul. Printed circuit board impedance matching step for microwave (millimeter wave) devices. United States.
Pao, Hsueh-Yuan, Aguirre, Jerardo, and Sargis, Paul. Tue . "Printed circuit board impedance matching step for microwave (millimeter wave) devices". United States. https://www.osti.gov/servlets/purl/1107573.
@article{osti_1107573,
title = {Printed circuit board impedance matching step for microwave (millimeter wave) devices},
author = {Pao, Hsueh-Yuan and Aguirre, Jerardo and Sargis, Paul},
abstractNote = {An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {10}
}

Patent:

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