skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method And Apparatus For Coupling Optical Elements To Optoelectronic Devices For Manufacturing Optical Transceiver Modules

Patent ·
OSTI ID:879689

A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element.

Research Organization:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
DOE Contract Number:
AC04-94AL85000
Assignee:
Emcore Corporation (Somerset, NJ)
Patent Number(s):
US 6905260
Application Number:
09/749287
OSTI ID:
879689
Country of Publication:
United States
Language:
English

References (16)

Characteristics of VCSEL arrays for parallel optical interconnects conference May 1996
OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
  • Wong, Y. M.; Muehlner, D. J.; Faudskar, C. C.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517403
conference January 1996
Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
  • De Pestel, G.; Picard, A.; Vandewege, J.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517402
conference January 1996
The PONI optoelectronic platform
  • Giboney, K.; Rosenberg, P.; Yuen, A.
  • 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009) https://doi.org/10.1109/LEOS.1999.813458
conference January 1999
A complete sub-system of parallel optical interconnects for telecom applications
  • Niburg, M.; Eriksen, P.; Gustafsson, K.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517401
conference January 1996
The PONI-1 parallel-optical link conference January 1999
The P-VixeLink/sup TM/ multichannel optical interconnect
  • Swirhun, S.; Dudek, M.; Neumann, R.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517408
conference January 1996
Power minimization and technology comparisons for digital free-space optoelectronic interconnections journal April 1999
Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
  • Liu, Y. S.; Wojnarowski, R. J.; Hennessy, W. A.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517407
conference January 1996
Gigabyte/s data communications with the POLO parallel optical link
  • Hahn, K. H.; Giboney, K. S.; Wilson, R. E.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517406
conference January 1996
The Jitney Parallel Optical Interconnect conference May 1996
1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics conference January 1999
Low-cost molded packaging for optical data links
  • Robinson, S. D.; Acarlar, M. S.; Chen, Y. C.
  • IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, Vol. 18, Issue 2 https://doi.org/10.1109/96.386247
journal May 1995
Low-power modular parallel photonic data links
  • Carson, R. F.; Lovejoy, M. L.; Lear, K. L.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.551417
conference January 1996
High alignment tolerance coupling scheme for multichannel laser diode/singlemode fibre modules using a tapered waveguide array journal September 1994
1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
  • Nagahori, T.; Miyoshi, K.; Hatakeyama, I.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517400
conference January 1996