Double sided circuit board and a method for its manufacture
Abstract
Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.
- Inventors:
- Issue Date:
- Research Org.:
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176602
- Patent Number(s):
- H000650
- Application Number:
- 07/182671
- Assignee:
- The United States of America as represented by the United States Department of Energy (Washington, DC)
- DOE Contract Number:
- AC02-76CH03000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 1988 Apr 14
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 42 ENGINEERING; 36 MATERIALS SCIENCE; statutory invention registration
Citation Formats
Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States: N. p., 1989.
Web.
Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States.
Lindenmeyer, Carl W. Tue .
"Double sided circuit board and a method for its manufacture". United States. https://www.osti.gov/servlets/purl/1176602.
@article{osti_1176602,
title = {Double sided circuit board and a method for its manufacture},
author = {Lindenmeyer, Carl W.},
abstractNote = {Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {7}
}
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