Double sided circuit board and a method for its manufacture

Lindenmeyer, Carl W.

Title: Double sided circuit board and a method for its manufacture

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Abstract

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Inventors:

Lindenmeyer, Carl W. ^[1]

St. Charles, IL

Issue Date:: 1989-01-01

Research Org.:: Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 875236

Patent Number(s):: H000650

Application Number:: 07/182671

Assignee:: United States of America as represented by United States (Washington, DC)

DOE Contract Number:: AC02-76CH03000

Resource Type:: Patent

Resource Relation:: Patent File Date: 1988 Apr 14

Country of Publication:: United States

Language:: English

Subject:: statutory invention registration; double; sided; circuit; board; method; manufacture; conductance; printed; provided; eliminates; chemical; immersion; photographic; exposure; entire; plurality; through-holes; drilled; punched; substratum; according; desired; pattern; conductive; laminae; adhere; covering; holes; pressed; permanently; joined; providing; paths; circuit board; printed circuit; conductive path; desired pattern; conductive paths; double sided; /174/29/

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                    Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture.  United States: N. p., 1989. 
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                    Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture.  United States.

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                    Lindenmeyer, Carl W. Sun .  
        "Double sided circuit board and a method for its manufacture".  United States.  https://www.osti.gov/servlets/purl/875236.

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@article{osti_875236,

  title        = {Double sided circuit board and a method for its manufacture},

  author       = {Lindenmeyer, Carl W.},

  abstractNote = {Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1989},

  month        = {1}

}

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Double sided circuit board and a method for its manufacture

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