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Title: Double sided circuit board and a method for its manufacture

Abstract

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Inventors:
 [1]
  1. St. Charles, IL
Issue Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
OSTI Identifier:
875236
Patent Number(s):
H650
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
AC02-76CH03000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
double; sided; circuit; board; method; manufacture; conductance; printed; provided; eliminates; chemical; immersion; photographic; exposure; entire; plurality; through-holes; drilled; punched; substratum; according; desired; pattern; conductive; laminae; adhere; covering; holes; pressed; permanently; joined; providing; paths; circuit board; printed circuit; conductive path; desired pattern; conductive paths; double sided; /174/29/

Citation Formats

Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States: N. p., 1989. Web.
Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States.
Lindenmeyer, Carl W. Sun . "Double sided circuit board and a method for its manufacture". United States. https://www.osti.gov/servlets/purl/875236.
@article{osti_875236,
title = {Double sided circuit board and a method for its manufacture},
author = {Lindenmeyer, Carl W},
abstractNote = {Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {1}
}

Patent:

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