Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly
Abstract
A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
- Inventors:
- Issue Date:
- Research Org.:
- Cree Fayetteville, Inc., Fayetteville, AR (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1531819
- Patent Number(s):
- 10076800
- Application Number:
- 14/954,243
- Assignee:
- Cree Fayetteville, Inc. (Fayetteville, AR)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- EE0006429; SC0008239
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015-11-30
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly. United States: N. p., 2018.
Web.
Stabach, Jennifer, McPherson, Brice, & O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly. United States.
Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Tue .
"Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly". United States. https://www.osti.gov/servlets/purl/1531819.
@article{osti_1531819,
title = {Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly},
author = {Stabach, Jennifer and McPherson, Brice and O'Neal, Chad B.},
abstractNote = {A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {9}
}