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Title: Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Abstract

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Inventors:
; ;
Issue Date:
Research Org.:
Cree Fayetteville, Inc., Fayetteville, AR (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531819
Patent Number(s):
10076800
Application Number:
14/954,243
Assignee:
Cree Fayetteville, Inc. (Fayetteville, AR)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
EE0006429; SC0008239
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015-11-30
Country of Publication:
United States
Language:
English

Citation Formats

Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly. United States: N. p., 2018. Web.
Stabach, Jennifer, McPherson, Brice, & O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly. United States.
Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Tue . "Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly". United States. https://www.osti.gov/servlets/purl/1531819.
@article{osti_1531819,
title = {Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly},
author = {Stabach, Jennifer and McPherson, Brice and O'Neal, Chad B.},
abstractNote = {A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {9}
}

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Works referenced in this record:

Solder-bearing wafer for use in soldering operations
patent, May 2005


Electronic device structure with studs locating lead frame on backing plate
patent, August 1994


Button rectifier package for non-planar die
patent, February 1985


Metallized paths on diamond surfaces
patent, August 1994


Multi-layer circuit board and semiconductor flip chip connection
patent, June 1998


Solder paste containment device
patent, October 2000