Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

Stabach, Jennifer; McPherson, Brice; O'Neal, Chad B.

Title: Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

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Abstract

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Inventors:: Stabach, Jennifer; McPherson, Brice; O'Neal, Chad B.

Issue Date:: 2018-09-18

Research Org.:: Cree Fayetteville, Inc., Fayetteville, AR (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1531819

Patent Number(s):: 10076800

Application Number:: 14/954,243

Assignee:: Cree Fayetteville, Inc. (Fayetteville, AR)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L23/13 - characterised by the shape

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0263 - {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means
H05K2201/09363 - wherein only contours around conductors are removed for insulation

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K26/362 - Laser etching
B23K1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/243 - {characterised by selective plating, e.g. for finish plating of pads

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/49894 - {Materials of the insulating layers or coatings}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2203/1173 - Differences in wettability, e.g. hydrophilic or hydrophobic areas
H05K3/341 - {Surface mounted components}

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K26/361 - for deburring or mechanical trimming

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K3/027 - {the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K1/0016 - {Brazing of electronic components}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2203/0315 - Oxidising metal

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/3735 - {Laminates or multilayers, e.g. direct bond copper ceramic substrates}

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DOE Contract Number:: EE0006429; SC0008239

Resource Type:: Patent

Resource Relation:: Patent File Date: 2015-11-30

Country of Publication:: United States

Language:: English

Citation Formats


                    Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly.  United States: N. p., 2018. 
        Web.

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                    Stabach, Jennifer, McPherson, Brice, & O'Neal, Chad B. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly.  United States.

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                    Stabach, Jennifer, McPherson, Brice, and O'Neal, Chad B. Tue .  
        "Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly".  United States.  https://www.osti.gov/servlets/purl/1531819.

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@article{osti_1531819,

  title        = {Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly},

  author       = {Stabach, Jennifer and McPherson, Brice and O'Neal, Chad B.},

  abstractNote = {A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2018},

  month        = {9}

}

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