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Title: Methods and apparatus for forming submicron patterns on films

Abstract

A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface: and hardening the structure in the first flowable medium to form the patterned film.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Univ. Konstanz (Germany); Univ. of Massachusetts, Boston, MA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531505
Patent Number(s):
7,014,786
Application Number:
10/144,961
Assignee:
Universitat Konstanz (DE); University of Massachusetts (Boston, MA)
DOE Contract Number:  
FG02-96ER45612; DMR-9809365
Resource Type:
Patent
Resource Relation:
Patent File Date: 2002-05-14
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE

Citation Formats

Schaffer, Erik, Mlynek, Jurgen, Steiner, Ullrich, Thurn-Albrecht, Thomas, and Russell, Thomas P. Methods and apparatus for forming submicron patterns on films. United States: N. p., 2006. Web.
Schaffer, Erik, Mlynek, Jurgen, Steiner, Ullrich, Thurn-Albrecht, Thomas, & Russell, Thomas P. Methods and apparatus for forming submicron patterns on films. United States.
Schaffer, Erik, Mlynek, Jurgen, Steiner, Ullrich, Thurn-Albrecht, Thomas, and Russell, Thomas P. Tue . "Methods and apparatus for forming submicron patterns on films". United States. https://www.osti.gov/servlets/purl/1531505.
@article{osti_1531505,
title = {Methods and apparatus for forming submicron patterns on films},
author = {Schaffer, Erik and Mlynek, Jurgen and Steiner, Ullrich and Thurn-Albrecht, Thomas and Russell, Thomas P.},
abstractNote = {A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface: and hardening the structure in the first flowable medium to form the patterned film.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {3}
}

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Works referenced in this record:

Chemical etching of record patterns and the like
patent, March 1979


Electro-lithography method
patent, October 1978


Process for patterning powders into thick layers
patent, October 1998


Methods and apparatus for forming submicron patterns on films
patent, May 2002