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Title: Silicon force sensor and method of using the same

Abstract

The various technologies presented herein relate to a sensor for measurement of high forces and/or high load shock rate(s), whereby the sensor utilizes silicon as the sensing element. A plate of Si can have a thinned region formed therein on which can be formed a number of traces operating as a Wheatstone bridge. The brittle Si can be incorporated into a layered structure comprising ductile and/or compliant materials. The sensor can have a washer-like configuration which can be incorporated into a nut and bolt configuration, whereby tightening of the nut and bolt can facilitate application of a compressive preload upon the sensor. Upon application of an impact load on the bolt, the compressive load on the sensor can be reduced (e.g., moves towards zero-load), however the magnitude of the preload can be such that the load on the sensor does not translate to tensile stress being applied to the sensor.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1327919
Patent Number(s):
9,459,161
Application Number:
15/170,355
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jun 01
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION; 36 MATERIALS SCIENCE

Citation Formats

Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., and Lantz, Jeffrey W. Silicon force sensor and method of using the same. United States: N. p., 2016. Web.
Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., & Lantz, Jeffrey W. Silicon force sensor and method of using the same. United States.
Galambos, Paul C., Crenshaw, Thomas B., Nishida, Erik E., Burnett, Damon J., and Lantz, Jeffrey W. Tue . "Silicon force sensor and method of using the same". United States. https://www.osti.gov/servlets/purl/1327919.
@article{osti_1327919,
title = {Silicon force sensor and method of using the same},
author = {Galambos, Paul C. and Crenshaw, Thomas B. and Nishida, Erik E. and Burnett, Damon J. and Lantz, Jeffrey W.},
abstractNote = {The various technologies presented herein relate to a sensor for measurement of high forces and/or high load shock rate(s), whereby the sensor utilizes silicon as the sensing element. A plate of Si can have a thinned region formed therein on which can be formed a number of traces operating as a Wheatstone bridge. The brittle Si can be incorporated into a layered structure comprising ductile and/or compliant materials. The sensor can have a washer-like configuration which can be incorporated into a nut and bolt configuration, whereby tightening of the nut and bolt can facilitate application of a compressive preload upon the sensor. Upon application of an impact load on the bolt, the compressive load on the sensor can be reduced (e.g., moves towards zero-load), however the magnitude of the preload can be such that the load on the sensor does not translate to tensile stress being applied to the sensor.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {10}
}

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Works referenced in this record:

Mechanical characterization in failure strength of silicon dice
conference, January 2004

  • Chong, D. Y. R.; Lee, W. E.; Lim, B. K.
  • The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
  • DOI: 10.1109/ITHERM.2004.1318284