High power impulse magnetron sputtering and related discharges: scalable plasma sources for plasma-based ion implantation and deposition

Journal Article · Tue Sep 01 04:00:00 EDT 2009 · Surface and Coatings Technology

OSTI ID:974435

Anders, Andre

High power impulse magnetron sputtering (HIPIMS) and related self-sputtering techniques are reviewed from a viewpoint of plasma-based ion implantation and deposition (PBII&D). HIPIMS combines the classical, scalable sputtering technology with pulsed power, which is an elegant way of ionizing the sputtered atoms. Related approaches, such as sustained self-sputtering, are also considered. The resulting intense flux of ions to the substrate consists of a mixture of metal and gas ions when using a process gas, or of metal ions only when using `gasless? or pure self-sputtering. In many respects, processing with HIPIMS plasmas is similar to processing with filtered cathodic arc plasmas, though the former is easier to scale to large areas. Both ion implantation and etching (high bias voltage, without deposition) and thin film deposition (low bias, or bias of low duty cycle) have been demonstrated.

• Research Organization: Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
• Sponsoring Organization: Accelerator& Fusion Research Division; Environmental Energy Technologies Division
• DOE Contract Number: AC02-05CH11231
• OSTI ID: 974435
• Report Number(s): LBNL-2550E
• Journal Information: Surface and Coatings Technology, Journal Name: Surface and Coatings Technology; ISSN 0257-8972; ISSN SCTEEJ
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
ATOMS
DEPOSITION
ETCHING
High power impulse magentron sputtering
plasma
review
ION IMPLANTATION
MAGNETRONS
MIXTURES
PLASMA
PROCESSING
SPUTTERING
SUBSTRATES
THIN FILMS