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Title: Microelectromechanical resonator and method for fabrication

Abstract

A method is disclosed for the robust fabrication of a microelectromechanical (MEM) resonator. In this method, a pattern of holes is formed in the resonator mass with the position, size and number of holes in the pattern being optimized to minimize an uncertainty .DELTA.f in the resonant frequency f.sub.0 of the MEM resonator due to manufacturing process variations (e.g. edge bias). A number of different types of MEM resonators are disclosed which can be formed using this method, including capacitively transduced Lame, wineglass and extensional resonators, and piezoelectric length-extensional resonators.

Inventors:
 [1];  [1]
  1. Albuquerque, NM
Publication Date:
Research Org.:
Sandia National Laboratories (SNL-NM), Albuquerque, NM
Sponsoring Org.:
USDOE
OSTI Identifier:
971523
Patent Number(s):
7,616,077
Application Number:
11/689,567
Assignee:
Sandia Corporation (Albuquerque, NM) SSO
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wittwer, Jonathan W, and Olsson, Roy H. Microelectromechanical resonator and method for fabrication. United States: N. p., 2009. Web.
Wittwer, Jonathan W, & Olsson, Roy H. Microelectromechanical resonator and method for fabrication. United States.
Wittwer, Jonathan W, and Olsson, Roy H. Tue . "Microelectromechanical resonator and method for fabrication". United States. https://www.osti.gov/servlets/purl/971523.
@article{osti_971523,
title = {Microelectromechanical resonator and method for fabrication},
author = {Wittwer, Jonathan W and Olsson, Roy H},
abstractNote = {A method is disclosed for the robust fabrication of a microelectromechanical (MEM) resonator. In this method, a pattern of holes is formed in the resonator mass with the position, size and number of holes in the pattern being optimized to minimize an uncertainty .DELTA.f in the resonant frequency f.sub.0 of the MEM resonator due to manufacturing process variations (e.g. edge bias). A number of different types of MEM resonators are disclosed which can be formed using this method, including capacitively transduced Lame, wineglass and extensional resonators, and piezoelectric length-extensional resonators.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2009},
month = {11}
}

Patent:

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