Process for fabricating a microelectromechanical structure
Patent
·
OSTI ID:1175096
A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.
- Research Organization:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation
- Patent Number(s):
- 6,808,952
- Application Number:
- 10/236,631
- OSTI ID:
- 1175096
- Country of Publication:
- United States
- Language:
- English
Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing
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conference | October 1998 |
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