Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle
Conference
·
OSTI ID:9685
- Sandia National Laboratories
Stress measurement test chips were flip chip assembled to organic BGA substrates containing micro-vias and epoxy build-up interconnect layers. Mechanical degradation observed during temperature cycling was correlated to a damage theory developed based on 3D finite element method analysis. Degradation included die cracking, edge delamination and radial fillet cracking.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 9685
- Report Number(s):
- SAND99-1999C
- Country of Publication:
- United States
- Language:
- English
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