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Kinetics of Ni3Si2 Formation in the Ni2Si-NiSi Thin Film Reaction from in situ Measurements

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.2822411· OSTI ID:959620
The kinetics of Ni3Si2 formation in the Ni2Si-NiSi thin film reaction were determined from simultaneous in situ x-ray diffraction (XRD) measurements, performed using a synchrotron source, and sheet resistance measurements. Samples consisted of 90 nm Ni/100 nm polycrystalline-Si/SiO2 stacks, of interest for fully silicided gate applications, on (100) Si. After initial formation of a Ni2Si/NiSi bilayer, these films reacted to form Ni3Si2. The evolution of sheet resistance and of the intensity of XRD peaks were used to extract the fraction of Ni3Si2 formed during ramp and isothermal annealings. A Kissinger analysis was performed for ramp annealing with ramp rates of 1, 3, 5, 9, and 27 C/s, obtaining the activation energy of Ni3Si2 formation, Ea = 1.92{+-}0.15 eV. A Kolmogorov-Johnson-Mehl-Avrami analysis was performed for isothermal anneals, finding an Avrami exponent of 2.1{+-}0.2, suggesting two-dimensional growth. This is consistent with a nucleation controlled process for Ni3Si2 formation, with nucleation sites at different positions in the thin film, and subsequent lateral two-dimensional propagation of the transformation front parallel to the film surface. Implications for Ni fully silicided gate applications are discussed.
Research Organization:
Brookhaven National Laboratory (BNL) National Synchrotron Light Source
Sponsoring Organization:
Doe - Office Of Science
DOE Contract Number:
AC02-98CH10886
OSTI ID:
959620
Report Number(s):
BNL--82606-2009-JA
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Vol. 91; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

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