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Correlation between oxidation resistance and crystallinity of Ti-Al as a barrier layer for high-density memories.

Journal Article · · Acta Materialia
The Ti-Al intermetallic material system has been investigated for application as a conducting diffusion barrier in a three-dimensional stacked capacitor-transistor geometry. La-Sr-Co-O (LSCO)/Pb-Zr-Ti-Nb-O/La-Sr-Co-O ferroelectric capacitors were fabricated on Ti-Al/polycrystalline-Si/Si substrates. The electrical and ferroelectric properties are found to correlate strongly with the crystallinity of the Ti-Al layer. The crystalline Ti-Al layer shows a distinct chemical reaction with the bottom LSCO electrode thus preventing ohmic electrical contact between the ferroelectric capacitor and transistor. In contrast, the amorphous Ti-Al layer does not react and forms an ohmic contact to LSCO. For crystalline Ti-Al, X-ray photoelectron spectroscopy (XPS) shows the formation of Al{sub 2}O{sub 3} induced by the segregation of Al to the LSCO/Ti-Al interface. For amorphous Ti-Al, XPS reveals that no Al{sub 2}O{sub 3} layer is formed. In addition, Rutherford backscattering analysis shows almost no difference in the Ti-peak spectrum before and after deposition of LSCO.
Research Organization:
Argonne National Laboratory (ANL)
Sponsoring Organization:
SC; NSF
DOE Contract Number:
AC02-06CH11357
OSTI ID:
942971
Report Number(s):
ANL/MSD/JA-36339
Journal Information:
Acta Materialia, Journal Name: Acta Materialia Journal Issue: 2000 Vol. 48; ISSN 1359-6454; ISSN ACMAFD
Country of Publication:
United States
Language:
ENGLISH