Composition and method for removing photoresist materials from electronic components

Patent · Tue Jun 03 00:00:00 EDT 2008

OSTI ID:936715

Davenhall, Leisa B ^[1]; Rubin, James B ^[2]; Taylor, Craig M. V. ^[3]

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1. Santa Fe, NM
2. Los Alamos, NM
3. Jemez Springs, NM

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

• Research Organization: Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-7405-ENG-36
• Assignee: Los Alamos National Security, LLC (Los Alamos, NM)
• Patent Number(s): 7,381,694
• Application Number: 11/034,519
• OSTI ID: 936715
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE