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Composition and method for removing photoresist materials from electronic components

Patent ·
OSTI ID:936715
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-36
Assignee:
Los Alamos National Security, LLC (Los Alamos, NM)
Patent Number(s):
7,381,694
Application Number:
11/034,519
OSTI ID:
936715
Country of Publication:
United States
Language:
English

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