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Dissolution characteristics of Al2Cu and Al-4%Cu thin films.

Journal Article · Thu Nov 30 23:00:00 EST 2006 · Proposed for publication in Electrochemical Society Transactions.

OSTI ID:909914

Ingham, B ^[1]; Vasiljevic, Natasa; Missert, Nancy A; Copeland, Robert Guild; Isaacs, H S ^[2]; Huang, R ^[3]

Industrial Research Limited, Wellington, New Zealand
Brookhaven National Laboratories, Upton, NY
Xiamen University, Xiamen, China

No abstract prepared.

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Research Organization:: Sandia National Laboratories

Sponsoring Organization:: USDOE

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 909914

Report Number(s):: SAND2006-7913J

Journal Information:: Proposed for publication in Electrochemical Society Transactions., Journal Name: Proposed for publication in Electrochemical Society Transactions.

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM ALLOYS
COPPER ALLOYS
DISSOLUTION
INTERMETALLIC COMPOUNDS
THIN FILMS