skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys

Abstract

No abstract prepared.

Authors:
; ; ;
Publication Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA
Sponsoring Org.:
USDOE Office of Science and Technology (OST) - (EM-50)
OSTI Identifier:
889498
Report Number(s):
IS-J 6827
Journal ID: ISSN 0361-5235; JECMA5; TRN: US200619%%585
DOE Contract Number:  
W-7405-Eng-82
Resource Type:
Journal Article
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 31; Journal Issue: 11; Journal ID: ISSN 0361-5235
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALLOYS; ELECTRIC CONDUCTIVITY; HEAT TREATMENTS

Citation Formats

Cook, B A, Anderson, I E, Harringa, J L, and Terpstra, R L. Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys. United States: N. p., 2002. Web.
Cook, B A, Anderson, I E, Harringa, J L, & Terpstra, R L. Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys. United States.
Cook, B A, Anderson, I E, Harringa, J L, and Terpstra, R L. Thu . "Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys". United States.
@article{osti_889498,
title = {Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys},
author = {Cook, B A and Anderson, I E and Harringa, J L and Terpstra, R L},
abstractNote = {No abstract prepared.},
doi = {},
journal = {Journal of Electronic Materials},
issn = {0361-5235},
number = 11,
volume = 31,
place = {United States},
year = {2002},
month = {6}
}