Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and its Effect on Electrical Resistivity
Journal Article
·
· Journal of Electronic Materials
OSTI ID:820705
No abstract prepared.
- Research Organization:
- Ames Laboratory (AMES), Ames, IA
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- W-7405-ENG-82
- OSTI ID:
- 820705
- Report Number(s):
- IS-J 6912
- Journal Information:
- Journal of Electronic Materials, Journal Name: Journal of Electronic Materials Journal Issue: 12 Vol. 32; ISSN JECMA5; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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