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Title: Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system

Abstract

A method for fabricating a thermophotovoltaic energy conversion cell including a thin semiconductor wafer substrate (10) having a thickness (.beta.) calculated to decrease the free carrier absorption on a heavily doped substrate; wherein the top surface of the semiconductor wafer substrate is provided with a thermophotovoltaic device (11), a metallized grid (12) and optionally an antireflective (AR) overcoating; and, the bottom surface (10') of the semiconductor wafer substrate (10) is provided with a highly reflecting coating which may comprise a metal coating (14) or a combined dielectric/metal coating (17).

Inventors:
 [1];  [1];  [1];  [1]
  1. Clifton Park, NY
Publication Date:
Research Org.:
Knolls Atomic Power Laboratory (KAPL), Niskayuna, NY
OSTI Identifier:
875174
Patent Number(s):
US H1856
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
AC12-76SN00052
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
lapped; substrate; enhanced; backsurface; reflectivity; thermophotovoltaic; energy; conversion; method; fabricating; cell; including; semiconductor; wafer; 10; thickness; beta; calculated; decrease; free; carrier; absorption; heavily; doped; top; surface; provided; device; 11; metallized; grid; 12; optionally; antireflective; overcoating; bottom; highly; reflecting; coating; comprise; metal; 14; combined; dielectric; 17; wafer substrate; thermophotovoltaic device; cell including; heavily doped; semiconductor wafer; top surface; photovoltaic device; energy conversion; metal coating; bottom surface; thermophotovoltaic energy; conversion cell; metallized grid; reflecting coating; photovoltaic energy; /136/438/

Citation Formats

Baldasaro, Paul F, Brown, Edward J, Charache, Greg W, and DePoy, David M. Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system. United States: N. p., 2000. Web.
Baldasaro, Paul F, Brown, Edward J, Charache, Greg W, & DePoy, David M. Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system. United States.
Baldasaro, Paul F, Brown, Edward J, Charache, Greg W, and DePoy, David M. Sat . "Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system". United States. https://www.osti.gov/servlets/purl/875174.
@article{osti_875174,
title = {Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system},
author = {Baldasaro, Paul F and Brown, Edward J and Charache, Greg W and DePoy, David M},
abstractNote = {A method for fabricating a thermophotovoltaic energy conversion cell including a thin semiconductor wafer substrate (10) having a thickness (.beta.) calculated to decrease the free carrier absorption on a heavily doped substrate; wherein the top surface of the semiconductor wafer substrate is provided with a thermophotovoltaic device (11), a metallized grid (12) and optionally an antireflective (AR) overcoating; and, the bottom surface (10') of the semiconductor wafer substrate (10) is provided with a highly reflecting coating which may comprise a metal coating (14) or a combined dielectric/metal coating (17).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

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