Multilayered microelectronic device package with an integral window
- Albuquerque, NM
- Tijeras, NM
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 6538312
- OSTI ID:
- 875129
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
microelectronic
device
package
integral
window
apparatus
packaging
devices
disclosed
semiconductor
chip
ccd
cmos
vcsel
laser
diode
mems
imems
example
cofired
ceramic
frame
internal
stepped
structure
plurality
plates
apertures
patterned
metallized
conductive
circuit
traces
flip-chip
bonded
plate
oriented
light-sensitive
optically
accessible
cover
lid
attached
opposite
result
compact
low-profile
hermetically-sealed
formed
low-temperature
ltcc
high-temperature
htcc
multilayer
processes
simultaneously
joined
processing
multiple
chips
located
single
embodiments
suited
handling
steps
greatly
reduced
reducing
potential
contamination
lens
transforming
light
passing
array
binary
optic
lenslets
electrically-switched
optical
modulator
lithium
niobate
providing
fast
electrically-operated
shutter
laser diode
light passing
semiconductor chip
electronic device
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