Pre-release plastic packaging of MEMS and IMEMS devices

Patent · Tue Jan 01 00:00:00 EST 2002

OSTI ID:874389

Peterson, Kenneth A ^[1]; Conley, William R ^[2]

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1. Albuquerque, NM
2. Tijeras, NM

A method is disclosed for pre-release plastic packaging of MEMS and IMEMS devices. The method can include encapsulating the MEMS device in a transfer molded plastic package. Next, a perforation can be made in the package to provide access to the MEMS elements. The non-ablative material removal process can include wet etching, dry etching, mechanical machining, water jet cutting, and ultrasonic machining, or any combination thereof. Finally, the MEMS elements can be released by using either a wet etching or dry plasma etching process. The MEMS elements can be protected with a parylene protective coating. After releasing the MEMS elements, an anti-stiction coating can be applied. The perforating step can be applied to both sides of the device or package. A cover lid can be attached to the face of the package after releasing any MEMS elements. The cover lid can include a window for providing optical access. The method can be applied to any plastic packaged microelectronic device that requires access to the environment, including chemical, pressure, or temperature-sensitive microsensors; CCD chips, photocells, laser diodes, VCSEL's, and UV-EPROMS. The present method places the high-risk packaging steps ahead of the release of the fragile portions of the device. It also provides protection for the die in shipment between the molding house and the house that will release the MEMS elements and subsequently treat the surfaces.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6379988
• OSTI ID: 874389
• Country of Publication: United States
• Language: English

Related Subjects

pre-release
plastic
packaging
mems
imems
devices
method
disclosed
encapsulating
device
transfer
molded
package
perforation
provide
access
elements
non-ablative
material
removal
process
wet
etching
dry
mechanical
machining
water
jet
cutting
ultrasonic
combination
finally
released
plasma
protected
parylene
protective
coating
releasing
anti-stiction
applied
perforating
step
cover
lid
attached
window
providing
optical
packaged
microelectronic
requires
environment
including
chemical
pressure
temperature-sensitive
microsensors
ccd
chips
photocells
laser
diodes
vcsels
uv-eproms
high-risk
steps
ahead
release
fragile
portions
provides
protection
die
shipment
molding
house
subsequently
treat
surfaces
laser diode
wet etching
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