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Protection of microelectronic devices during packaging

Patent ·
OSTI ID:874193
 [1];  [2]
  1. Albuquerque, NM
  2. Tijeras, NM
+ Show Author Affiliations

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 6335224
OSTI ID:
874193
Country of Publication:
United States
Language:
English

References (2)

Electrically removable, micromachined encapsulation for sensitive materials journal July 1997
Photolithographic packaging of silicon pressure sensors journal April 1998

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Related Subjects

/438/
acid
aluminum
applying
attaching
carbon
carboxylic
coating
combinations
cynoacrylate
deposited
device
devices
dioxide
disposed
dry
electrically
electronic device
element
etching
film
glass
hexamethyldisilazane
including
interconnecting
material
mems
metal
method
microelectronic
monolayered
nitride
organic
package
packaging
parylene
perfluorodecanoic
perfluoropolyether
performing
plasma
polymer
protecting
protection
protective
providing
relates
released
removing
self-assembled
sensitive
silicate
silicon
silicon nitride
step
steps
substantially
tungsten
vacuum
vapor
vapor deposited
vapor-deposited
wafer
water-insoluble