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Temporary coatings for protection of microelectronic devices during packaging

Patent ·
OSTI ID:1175208
;

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Research Organization:
Sandia National Laboratories (SNL-CA), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation
Patent Number(s):
6,844,623
Application Number:
09/955,722
OSTI ID:
1175208
Country of Publication:
United States
Language:
English

References (5)

Hermetic plastic packages with applications to ruggedized boards conference January 1991
Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines journal June 1998
C-shield parylene allows major weight saving for EM shielding of microelectronics conference January 1997
Interface-adhesion-enhanced bi-layer conformal coating for avionics application
  • Wu, Jiali; Pike, R. T.; Wong, C. P.
  • Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) https://doi.org/10.1109/ISAPM.1999.757330
conference March 1999
Internal Conformal Coatings for Microcircuits journal December 1978

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Related Subjects

36 MATERIALS SCIENCE