High numerical aperture ring field projection system for extreme ultraviolet lithography
Patent
·
OSTI ID:874124
- 218 Eastridge Dr., San Ramon, CA 94583-4905
An all-reflective optical system for a projection photolithography camera has a source of EUV radiation, a wafer and a mask to be imaged on the wafer. The optical system includes a first concave mirror, a second mirror, a third convex mirror, a fourth concave mirror, a fifth convex mirror and a sixth concave mirror. The system is configured such that five of the six mirrors receives a chief ray at an incidence angle of less than substantially 12.degree., and each of the six mirrors receives a chief ray at an incidence angle of less than substantially 15.degree.. Four of the six reflecting surfaces have an aspheric departure of less than substantially 7 .mu.m. Five of the six reflecting surfaces have an aspheric departure of less than substantially 14 .mu.m. Each of the six reflecting surfaces has an aspheric departure of less than 16.0 .mu.m.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Hudyma; Russell (218 Eastridge Dr., San Ramon, CA 94583-4905)
- Patent Number(s):
- US 6318869
- OSTI ID:
- 874124
- Country of Publication:
- United States
- Language:
- English
Optical system design issues in development of projection camera for EUV lithography
|
conference | May 1995 |
EUV optical design for a 100-nm CD imaging system
|
conference | June 1998 |
Design of reflective relay for soft x-ray lithography
|
conference | January 1991 |
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Related Subjects
/359/
12degree
14
15degree
160
all-reflective
all-reflective optical
angle
aperture
aspheric
camera
chief
concave
configured
convex
departure
euv
extreme
extreme ultraviolet
field
field projection
fifth
five
fourth
imaged
incidence
incidence angle
lithography
mask
mirror
mirrors
mum
numerical
optical
photolithography
photolithography camera
projection
projection photolithography
radiation
ray
receives
reflecting
reflecting surface
six
sixth
source
substantially
surfaces
third
ultraviolet
wafer
12degree
14
15degree
160
all-reflective
all-reflective optical
angle
aperture
aspheric
camera
chief
concave
configured
convex
departure
euv
extreme
extreme ultraviolet
field
field projection
fifth
five
fourth
imaged
incidence
incidence angle
lithography
mask
mirror
mirrors
mum
numerical
optical
photolithography
photolithography camera
projection
projection photolithography
radiation
ray
receives
reflecting
reflecting surface
six
sixth
source
substantially
surfaces
third
ultraviolet
wafer