Method of deforming a biaxially textured buffer layer on a textured metallic substrate and articles therefrom

Lee, Dominic F; Kroeger, Donald M; Goyal, Amit

Method of deforming a biaxially textured buffer layer on a textured metallic substrate and articles therefrom

Patent · Fri Dec 31 23:00:00 EST 1999

OSTI ID:873218

Lee, Dominic F ^[1]; Kroeger, Donald M ^[1]; Goyal, Amit ^[1]

Knoxville, TN

The present invention provides methods and biaxially textured articles having a deformed epitaxial layer formed therefrom for use with high temperature superconductors, photovoltaic, ferroelectric, or optical devices. A buffer layer is epitaxially deposited onto biaxially-textured substrates and then mechanically deformed. The deformation process minimizes or eliminates grooves, or other irregularities, formed on the buffer layer while maintaining the biaxial texture of the buffer layer. Advantageously, the biaxial texture of the buffer layer is not altered during subsequent heat treatments of the deformed buffer. The present invention provides mechanical densification procedures which can be incorporated into the processing of superconducting films through the powder deposit or precursor approaches without incurring unfavorable high-angle grain boundaries.

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Research Organization:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN

DOE Contract Number:: AC05-96OR22464

Assignee:: UT-Battelle, LLC (Oakridge, TN)

Patent Number(s):: US 6114287

OSTI ID:: 873218

Country of Publication:: United States

Language:: English

References (17)

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Method of deforming a biaxially textured buffer layer on a textured metallic substrate and articles therefrom

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References (17)

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