Methods of fabricating applique circuits
Patent
·
OSTI ID:872509
- Albuquerque, NM
Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.
- Research Organization:
- SANDIA CORP
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 5950292
- Application Number:
- 08/811,305
- OSTI ID:
- 872509
- Country of Publication:
- United States
- Language:
- English
Integrated Decoupling Capacitors using Pb(Zr,Ti)O 3 Thin Films
|
journal | January 1996 |
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Related Subjects
/29/216/427/
advanced
amounts
application
applications
applique
applique circuits
appropriate
bonded
capacitance
circuit
circuitry
circuits
control
conventional
coupling
effects
fabricating
frequency circuit
high-frequency
immediate
integrated
integrated circuit
integration
introduced
methods
minimizing
modern
multichip
nanofarads
noise
noise reduction
operation
packaging
parasitic
particularly
particularly suited
reduction
required
simple
structure
structures
suitable
suited
technology
advanced
amounts
application
applications
applique
applique circuits
appropriate
bonded
capacitance
circuit
circuitry
circuits
control
conventional
coupling
effects
fabricating
frequency circuit
high-frequency
immediate
integrated
integrated circuit
integration
introduced
methods
minimizing
modern
multichip
nanofarads
noise
noise reduction
operation
packaging
parasitic
particularly
particularly suited
reduction
required
simple
structure
structures
suitable
suited
technology