Methods of fabricating applique circuits
Patent
·
OSTI ID:20013817
Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.
- Sponsoring Organization:
- US Department of Energy
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 20013817
- Country of Publication:
- United States
- Language:
- English
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