Heating device for semiconductor wafers

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872418

Vosen, Steven R ^[1]

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1. Berkeley, CA

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernable pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: AG Associates (San Jose, CA)
• Patent Number(s): US 5930456
• OSTI ID: 872418
• Country of Publication: United States
• Language: English

Related Subjects

heating
device
semiconductor
wafers
apparatus
heat
treating
disclosed
contains
assembly
light
energy
sources
emitting
wafer
particular
positioned
radial
zones
created
heated
instance
embodiment
form
spiral
configuration
alternative
appear
randomly
dispersed
respect
discernable
pattern
third
concentric
rings
tuning
placed
semiconductor wafers
heating device
concentric rings
light energy
energy sources
semiconductor wafer
light source
energy source
light sources
alternative embodiment
heat treating
spiral configuration
emitting light
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