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Title: Heating device for semiconductor wafers

Abstract

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernable pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.

Inventors:
 [1]
  1. Berkeley, CA
Publication Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
872418
Patent Number(s):
US 5930456
Assignee:
AG Associates (San Jose, CA)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
heating; device; semiconductor; wafers; apparatus; heat; treating; disclosed; contains; assembly; light; energy; sources; emitting; wafer; particular; positioned; radial; zones; created; heated; instance; embodiment; form; spiral; configuration; alternative; appear; randomly; dispersed; respect; discernable; pattern; third; concentric; rings; tuning; placed; semiconductor wafers; heating device; concentric rings; light energy; energy sources; semiconductor wafer; light source; energy source; light sources; alternative embodiment; heat treating; spiral configuration; emitting light; /392/219/

Citation Formats

Vosen, Steven R. Heating device for semiconductor wafers. United States: N. p., 1999. Web.
Vosen, Steven R. Heating device for semiconductor wafers. United States.
Vosen, Steven R. Fri . "Heating device for semiconductor wafers". United States. https://www.osti.gov/servlets/purl/872418.
@article{osti_872418,
title = {Heating device for semiconductor wafers},
author = {Vosen, Steven R},
abstractNote = {An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernable pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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