Heating device for semiconductor wafers
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernible pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light. 4 figs.
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- AG Associates, San Jose, CA (United States)
- Patent Number(s):
- US 5930456; A
- Application Number:
- PPN: US 9-078865
- OSTI ID:
- 6433732
- Resource Relation:
- Patent File Date: 14 May 1998
- Country of Publication:
- United States
- Language:
- English
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