Apparatus and method for measuring the thickness of a semiconductor wafer

Patent · Tue Mar 07 00:00:00 EST 1995

OSTI ID:27720

Ciszek, T F

Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.

• Research Organization: Midwest Research Institute, Kansas City, MO (United States); National Renewable Energy Laboratory (NREL), Golden, CO (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC02-83CH10093
• Assignee: CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426
• Patent Number(s): US 5,396,332/A/
• Application Number: PAN: 8-014,642
• OSTI ID: 27720
• Resource Relation: Other Information: PBD: 7 Mar 1995
• Country of Publication: United States
• Language: English

Related Subjects

44 INSTRUMENTATION
INCLUDING NUCLEAR AND PARTICLE DETECTORS
SEMICONDUCTOR MATERIALS
THICKNESS
THICKNESS GAGES
DESIGN
MATERIALS HANDLING EQUIPMENT
LIGHT TRANSMISSION
VISIBLE RADIATION