Apparatus and method for measuring the thickness of a semiconductor wafer

Patent · 01 January 1995

OSTI ID:869781

Ciszek, Theodoer F ^[1]

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1. 31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439

Apparatus for measuring thicknesses of semiconductor wafers, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light.

• Research Organization: MIDWEST RESEARCH INSTITUTE
• Sponsoring Organization: USDOE
• DOE Contract Number: AC02-83CH10093
• Assignee: Ciszek, Theodoer F. (31843 Miwok Trail, P.O. Box 1453, Evergreen, CO 80439)
• Patent Number(s): US 5396332
• OSTI ID: 869781
• Country of Publication: United States
• Language: English

Related Subjects

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adapted
apparatus
comprising
detector
distance
emit
emit light
environment
housing
housing means
impinge
impinges
light
light detector
light source
light transmitted
light-tight
means
measuring
measuring thickness
method
mounted
normally
opposite
predetermined
predetermined distance
predetermined wavelength
receive
receive light
semiconductor
semiconductor wafer
semiconductor wafers
source
source mounted
supported
supporting
thickness
thicknesses
transmitted
transmitted light
wafer
wafers
wavelength