Solderability test system

Patent · Thu Jan 01 04:00:00 EST 1998

OSTI ID:871937

Yost, Fred ^[1]; Hosking, Floyd M ^[2]; Jellison, James L ^[2]; Short, Bruce ^[3]; Giversen, Terri ^[3]; Reed, Jimmy R ^[4]

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1. Cedar Crest, NM
2. Albuquerque, NM
3. Beverly, MA
4. Austin, TX

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

• Research Organization: AT & T CORP
• DOE Contract Number: AC04-76DP00789
• Assignee: Sandia National Laboratories (Albuquerque, NM)
• Patent Number(s): US 5827951
• OSTI ID: 871937
• Country of Publication: United States
• Language: English

Related Subjects

/73/228/
analysis
analysis technique
based
board
capillary
capillary flow
conducting
data
developed
distance
evaluating
feasibility
finish
flow
flux
image
image analysis
line
line width
lines
method
narrow
narrow strip
pad
predry
printed
printed wiring
procedure
quantify
radius
ratio
revealed
sensitive
solder
solderability
strips
surface
surface finish
technique
tests
time
video
video image
volume
wetted
width
wiring
wiring board