Solderability test system
Patent
·
OSTI ID:675850
A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.
- Research Organization:
- AT&T
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia National Labs., Albuquerque, NM (United States)
- Patent Number(s):
- US 5,827,951/A/
- Application Number:
- PAN: 8-426,543
- OSTI ID:
- 675850
- Resource Relation:
- Other Information: PBD: 27 Oct 1998
- Country of Publication:
- United States
- Language:
- English
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