Solderability test system

Patent · Thu Jan 01 00:00:00 EST 1998

OSTI ID:871937

Yost, Fred ^[1]; Hosking, Floyd M ^[2]; Jellison, James L ^[2]; Short, Bruce ^[3]; Giversen, Terri ^[3]; Reed, Jimmy R ^[4]

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1. Cedar Crest, NM
2. Albuquerque, NM
3. Beverly, MA
4. Austin, TX

A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

• Research Organization: AT&T
• DOE Contract Number: AC04-76DP00789
• Assignee: Sandia National Laboratories (Albuquerque, NM)
• Patent Number(s): US 5827951
• OSTI ID: 871937
• Country of Publication: United States
• Language: English

Related Subjects

solderability
method
quantify
capillary
flow
printed
wiring
board
surface
finish
based
solder
pad
narrow
strips
lines
procedure
video
image
analysis
technique
developed
conducting
evaluating
data
feasibility
tests
revealed
wetted
distance
sensitive
ratio
radius
line
width
volume
flux
predry
time
surface finish
video image
printed wiring
analysis technique
narrow strip
line width
wiring board
image analysis
capillary flow
/73/228/